| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Transient DOS when WLAN firmware receives "reassoc response" frame including RIC_DATA element. |
| Memory corruption in Core while processing control functions. |
| Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. |
| Transient DOS while processing received beacon frame. |
| Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. |
| Memory corruption in Audio while processing RT proxy port register driver. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Transient DOS in WLAN Firmware while parsing a BTM request. |
| Memory corruption while invoking HGSL IOCTL context create. |
| Memory corruption while parsing the ADSP response command. |
| Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. |
| Memory corruption when the payload received from firmware is not as per the expected protocol size. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in Audio during playback with speaker protection. |
| Denial of service in WLAN due to out-of-bound read happens while processing VHT action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Information disclosure in WLAN due to improper length check while processing authentication handshake in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |